A-E Electronics
En | Ro




WE
ASSEMBLE
THE FUTURE!






Electronic Subassemblies

The current SMT technology, medium and high capacity, allows the assembling of various components from 0201 to BGA over 35 mm. Humidity-sensitive components are handled within a "dry chain" from warehouse until assembled on the PCB.

Processes are permanently controlled, including feedback from AOI and X-ray inspection.

The high degree of cleanliness of the assembled PWA is ensured by washing in state-of-the-art special equipment, checked and measured with Zero Ion tester.

All electronic subassemblies are checked on ICT/JTAG stations or dedicated test equipment.